Dicing a glass wafer
Glass wafers are used for a wide variety of applications, from semiconductor processing to microfluidic chips used for biotechnology devices.
VY Optics offers precision glass dicing services and for customer-supplied materials, substrates and components. Our cutting technology incorporates vision alignment systems and high-resolution closed loop linear positioning encoders.
We dice to high tolerances and offer an express service to the micro electronics and optical industry.
There are many ways to cut glass. Using scribing and breaking methods are simple and clean. We don’t use lubricants but clean our cutting wheels and pointed scribers frequently.
It can be quite intimidating to cleave a large glass wafer. We have cleaved wafers 300 mm in diameter and 100 microns thin. Borosilicate, fused silica and quartz glass are all best cleaved using diamond cutters and scribes. Soft soda lime glass typically, used for glass slides can be cut with tungsten carbide cutters as well as diamond scribes.
- Saws are fully CNC programmable
- Full cut through, scribed, bevelled and trenching, edges polished
- Thicknesses cut from 100 microns to 6mm
- Dicing tolerance to 10 microns
- Material/component size up to 300mm dia – 200mm square
- Kerf/blade material loss: 100-300 microns
Video of LiNbO3 Crystal Wafers
People also ask
What is dicing in glass?
Dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing with a dicing saw or by laser cutting. All methods are typically automated to ensure precision and accuracy.
What is laser dicing of glass wafers?
Laser dicing is a method of separating the silicon wafer into die using laser beam processes. Either feeding the laser over the front side of the thinned wafer or repeatedly irradiating the silicon wafer until a cut in the tape is made
How do you cut quartz wafers?
Borosilicate, fused silica and quartz glass are all best cleaved using diamond cutters and scribes. Soft soda lime glass typically, used for glass slides can be cut with tungsten carbide cutters as well as diamond scribes.
How do you cut fused silica wafer?
Cutting: Typically, band and wire saws as well as chop saws are used to cut fused silica. The cut loss and the surface quality depends on the machine and the feed speed. It is also possible to cut fused silica using CO2-Lasers or a water jet machine.
How does laser dicing work?
The laser beam hits the surface of the material and heats it so strongly that it melts or completely vaporizes. Once the laser beam has completely penetrated the material at one point, the actual cutting process begins. The laser system follows the selected geometry and separates the material in the process.
What is the point of dicing?
Dicing is a culinary knife cut in which the food item is cut into small blocks or dice. This may be done for aesthetic reasons or to create uniformly sized pieces to ensure even cooking. Dicing allows for distribution of flavour and texture throughout the dish, as well as a somewhat quicker cooking time.