Glass Dicing

Vyoptics offers precision glass dicing services and for customer-supplied materials, substrates and components. Our cutting technology incorporates vision alignment systems and high-resolution closed loop linear positioning encoders.
We dice to high tolerances and offer an express service to the micro electronics and optical industry. Our equipment includes a Loadpoint NanoAce 3300 and a MicroAce machine. One off R&D jobs are undertaken to volume production.

Dicing Capabilities:

  • Saws are fully CNC programmable
  • Full cut through, scribed, bevelled and trenching, edges polished
  • Thicknesses cut from 100 microns to 6mm
  • Dicing tolerance to 10 microns
  • Material/component size up to 300mm dia – 200mm square
  • Kerf/blade material loss: 100-300 microns

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